Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs

Shreepad Panth, Sandeep Kumar Samal, Yun Seop Yu, Sung Kyu Lim. Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs. J. Inform. and Commun. Convergence Engineering, 12(3):186-192, 2014. [doi]

Abstract

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