TiLA: Twin-in-the-Loop Architecture for Cyber-Physical Production Systems

HeeJong Park 0001, Arvind Easwaran, Sidharta Andalam. TiLA: Twin-in-the-Loop Architecture for Cyber-Physical Production Systems. In 37th IEEE International Conference on Computer Design, ICCD 2019, Abu Dhabi, United Arab Emirates, November 17-20, 2019. pages 82-90, IEEE, 2019. [doi]

@inproceedings{ParkEA19,
  title = {TiLA: Twin-in-the-Loop Architecture for Cyber-Physical Production Systems},
  author = {HeeJong Park 0001 and Arvind Easwaran and Sidharta Andalam},
  year = {2019},
  doi = {10.1109/ICCD46524.2019.00019},
  url = {https://doi.org/10.1109/ICCD46524.2019.00019},
  researchr = {https://researchr.org/publication/ParkEA19},
  cites = {0},
  citedby = {0},
  pages = {82-90},
  booktitle = {37th IEEE International Conference on Computer Design, ICCD 2019, Abu Dhabi, United Arab Emirates, November 17-20, 2019},
  publisher = {IEEE},
  isbn = {978-1-5386-6648-7},
}