Comparison of thermo-mechanical behavior of lead-free copper and tin-lead column grid array packages

S.-B. Park, Rahul Joshi. Comparison of thermo-mechanical behavior of lead-free copper and tin-lead column grid array packages. Microelectronics Reliability, 48(5):763-772, 2008. [doi]

Authors

S.-B. Park

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Rahul Joshi

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