S.-B. Park, Rahul Joshi. Comparison of thermo-mechanical behavior of lead-free copper and tin-lead column grid array packages. Microelectronics Reliability, 48(5):763-772, 2008. [doi]
@article{ParkJ08-1,
title = {Comparison of thermo-mechanical behavior of lead-free copper and tin-lead column grid array packages},
author = {S.-B. Park and Rahul Joshi},
year = {2008},
doi = {10.1016/j.microrel.2007.12.008},
url = {http://dx.doi.org/10.1016/j.microrel.2007.12.008},
researchr = {https://researchr.org/publication/ParkJ08-1},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {48},
number = {5},
pages = {763-772},
}