Jin Soo Park, Seoung Bum Kim. Prediction of Package Chip Quality Using Fail Bit Count Data of the Probe Test. In Moonis Ali, Young Sig Kwon, Chang-Hwan Lee, Juntae Kim, Yongdai Kim, editors, Current Approaches in Applied Artificial Intelligence - 28th International Conference on Industrial, Engineering and Other Applications of Applied Intelligent Systems, IEA/AIE 2015, Seoul, South Korea, June 10-12, 2015, Proceedings. Volume 9101 of Lecture Notes in Computer Science, pages 655-664, Springer, 2015. [doi]
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