A Visual Inspection Method Based on Periodic Feature for Wheel Mark Defect on Wafer Backside

YangSub Park, KilBum Kang, SeongSoo Kim. A Visual Inspection Method Based on Periodic Feature for Wheel Mark Defect on Wafer Backside. In Michael Felsberg, Anders Heyden, Norbert Krüger, editors, Computer Analysis of Images and Patterns - 17th International Conference, CAIP 2017, Ystad, Sweden, August 22-24, 2017, Proceedings, Part I. Volume 10424 of Lecture Notes in Computer Science, pages 219-227, Springer, 2017. [doi]

Abstract

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