Jaehyun Park, Alish Kanani, Lukas Pfromm, Harsh Sharma, Parth Solanki, Eric Tervo, Janardhan Rao Doppa, Partha Pratim Pande, Ümit Y. Ogras. Thermal Modeling and Management Challenges in Heterogenous Integration: 2.5D Chiplet Platforms and Beyond. In 42nd IEEE VLSI Test Symposium, VTS 2024, Tempe, AZ, USA, April 22-24, 2024. pages 1-4, IEEE, 2024. [doi]
Abstract is missing.