Jaehong Park, Sangmin Lee, Dong-Il Cho. Comparative study of the wafer bonding processes for MEMS devices. In 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2011, Kaohsiung, Taiwan, February 20-23, 2011. pages 638-641, IEEE, 2011. [doi]
Abstract is missing.