Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging

Jongwoo Park, John Osenbach. Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging. Microelectronics Reliability, 46(2-4):503-511, 2006. [doi]

Abstract

Abstract is missing.