Seung Hwan Park, Cheong-Sool Park, Jun-Seok Kim, Sung-Shick Kim, Jun-Geol Baek, Daewoong An. Data Mining Approaches for Packaging Yield Prediction in the Post-fabrication Process. In IEEE International Congress on Big Data, BigData Congress 2013, June 27 2013-July 2, 2013. pages 363-368, IEEE, 2013. [doi]
Abstract is missing.