Vladimir Pasca, Saif-Ur Rehman, Lorena Anghel, Mounir Benabdenbi. Efficient link-level error resilience in 3D NoCs. In Jaan Raik, Viera Stopjaková, Heinrich Theodor Vierhaus, Witold A. Pleskacz, Raimund Ubar, Helena Kruus, Maksim Jenihhin, editors, IEEE 15th International Symposium on Design and Diagnostics of Electronic Circuits & Systems, DDECS 2012, Tallinn, Estonia, April 18-20, 2012. pages 127-132, IEEE, 2012. [doi]
@inproceedings{PascaRAB12,
title = {Efficient link-level error resilience in 3D NoCs},
author = {Vladimir Pasca and Saif-Ur Rehman and Lorena Anghel and Mounir Benabdenbi},
year = {2012},
doi = {10.1109/DDECS.2012.6219038},
url = {http://dx.doi.org/10.1109/DDECS.2012.6219038},
researchr = {https://researchr.org/publication/PascaRAB12},
cites = {0},
citedby = {0},
pages = {127-132},
booktitle = {IEEE 15th International Symposium on Design and Diagnostics of Electronic Circuits & Systems, DDECS 2012, Tallinn, Estonia, April 18-20, 2012},
editor = {Jaan Raik and Viera Stopjaková and Heinrich Theodor Vierhaus and Witold A. Pleskacz and Raimund Ubar and Helena Kruus and Maksim Jenihhin},
publisher = {IEEE},
isbn = {978-1-4673-1187-8},
}