James Patchett, Polina Zavyalova, Eusebiu Sutu, Noel Moore, Patrick Salter. Towards multicore fiber-to-chip interposers for spatial division multiplexing without active alignment. In Eric Keller, Sangtae Ha, Laurent Vanbever, Theophilus Benson, editors, Proceedings of the ACM SIGCOMM 2026 Conference, SIGCOMM 2026, Colorado Convention Center, Denver, CO, USA, August 17-21, 2026. pages 2083-2085, ACM, 2026. [doi]
Abstract is missing.