Advanced Packaging, Heterogeneous Integration, and Foundry 2.0

Robert Patti. Advanced Packaging, Heterogeneous Integration, and Foundry 2.0. In 67th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2024, Springfield, MA, USA, August 11-14, 2024. pages 873-874, IEEE, 2024. [doi]

Abstract

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