Songwei Pei, Jingdong Zhang, Yu Jin, Song Jin, Jun Liu, Weizhi Xu. An Effective TSV Self-Repair Scheme for 3D-Stacked ICs. In Alex K. Jones, Hai Helen Li, Ayse Kivilcim Coskun, Martin Margala, editors, Proceedings of the 25th edition on Great Lakes Symposium on VLSI, GLVLSI 2015, Pittsburgh, PA, USA, May 20 - 22, 2015. pages 21-26, ACM, 2015. [doi]
@inproceedings{PeiZJJLX15,
title = {An Effective TSV Self-Repair Scheme for 3D-Stacked ICs},
author = {Songwei Pei and Jingdong Zhang and Yu Jin and Song Jin and Jun Liu and Weizhi Xu},
year = {2015},
doi = {10.1145/2742060.2742071},
url = {http://doi.acm.org/10.1145/2742060.2742071},
researchr = {https://researchr.org/publication/PeiZJJLX15},
cites = {0},
citedby = {0},
pages = {21-26},
booktitle = {Proceedings of the 25th edition on Great Lakes Symposium on VLSI, GLVLSI 2015, Pittsburgh, PA, USA, May 20 - 22, 2015},
editor = {Alex K. Jones and Hai Helen Li and Ayse Kivilcim Coskun and Martin Margala},
publisher = {ACM},
isbn = {978-1-4503-3474-7},
}