Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM - researchr publication authors

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Yarui Peng, Bon Woong Ku, Youn-Sik Park, Kwang-Il Park, Seong-Jin Jang, Joo-Sun Choi, Sung Kyu Lim. Design, packaging, and architectural policy co-optimization for DC power integrity in 3D DRAM. In Proceedings of the 52nd Annual Design Automation Conference, San Francisco, CA, USA, June 7-11, 2015. pages 91, ACM, 2015. [doi]

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