Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim. Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling. IEEE Trans. on CAD of Integrated Circuits and Systems, 33(12):1900-1913, 2014. [doi]
@article{PengSPL14,
title = {Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling},
author = {Yarui Peng and Taigon Song and Dusan Petranovic and Sung Kyu Lim},
year = {2014},
doi = {10.1109/TCAD.2014.2359578},
url = {http://dx.doi.org/10.1109/TCAD.2014.2359578},
researchr = {https://researchr.org/publication/PengSPL14},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {33},
number = {12},
pages = {1900-1913},
}