Characterization method of thermomechanical parameters for microelectronic materials

O. Perat, J. M. Dorkel, E. Scheid, Pierre Temple-Boyer, Y. S. Chung, A. Peyre-Lavigne, M. Zecri, P. Tounsi. Characterization method of thermomechanical parameters for microelectronic materials. Microelectronics Reliability, 42(7):1053-1058, 2002. [doi]

Abstract

Abstract is missing.