Semiconductor Wafer Surface: Automatic Defect Classification with Deep CNN

Charissa Phua, Lau Bee Theng. Semiconductor Wafer Surface: Automatic Defect Classification with Deep CNN. In 2020 IEEE Region 10 Conference, TENCON 2020, Osaka, Japan, November 16-19, 2020. pages 714-719, IEEE, 2020. [doi]

@inproceedings{PhuaT20,
  title = {Semiconductor Wafer Surface: Automatic Defect Classification with Deep CNN},
  author = {Charissa Phua and Lau Bee Theng},
  year = {2020},
  doi = {10.1109/TENCON50793.2020.9293715},
  url = {https://doi.org/10.1109/TENCON50793.2020.9293715},
  researchr = {https://researchr.org/publication/PhuaT20},
  cites = {0},
  citedby = {0},
  pages = {714-719},
  booktitle = {2020 IEEE Region 10 Conference, TENCON 2020, Osaka, Japan, November 16-19, 2020},
  publisher = {IEEE},
  isbn = {978-1-7281-8455-5},
}