Peili Ping, Aiqiang Cheng, Yuchao Li, Shuai Wang. Analysis and Optimization of Thermal Matching between Multi-core Connector and Encapsulated Aluminum Shell. In 2021 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2021, Zhuhai, China, November 24-26, 2021. pages 94-95, IEEE, 2021. [doi]
Abstract is missing.