Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne. Design issues and considerations for low-cost 3D TSV IC technology. In IEEE International Solid-State Circuits Conference, ISSCC 2010, Digest of Technical Papers, San Francisco, CA, USA, 7-11 February, 2010. pages 148-149, IEEE, 2010. [doi]
@inproceedings{PlasLMOTTLSKVSCVSWLPBMCROPBORWDNADTMB10,
title = {Design issues and considerations for low-cost 3D TSV IC technology},
author = {Geert Van der Plas and Paresh Limaye and Abdelkarim Mercha and Herman Oprins and Cristina Torregiani and Steven Thijs and Dimitri Linten and Michele Stucchi and Guruprasad Katti and Dimitrios Velenis and Domae Shinichi and Vladimir Cherman and Bart Vandevelde and Veerle Simons and Ingrid De Wolf and Riet Labie and Dan Perry and Stephane Bronckers and Nikolaos Minas and Miro Cupac and Wouter Ruythooren and Jan Van Olmen and Alain Phommahaxay and Muriel de Potter de ten Broeck and Ann Opdebeeck and Michal Rakowski and Bart De Wachter and Morin Dehan and Marc Nelis and Rahul Agarwal and Wim Dehaene and Youssef Travaly and Pol Marchal and Eric Beyne},
year = {2010},
doi = {10.1109/ISSCC.2010.5434016},
url = {http://dx.doi.org/10.1109/ISSCC.2010.5434016},
researchr = {https://researchr.org/publication/PlasLMOTTLSKVSCVSWLPBMCROPBORWDNADTMB10},
cites = {0},
citedby = {0},
pages = {148-149},
booktitle = {IEEE International Solid-State Circuits Conference, ISSCC 2010, Digest of Technical Papers, San Francisco, CA, USA, 7-11 February, 2010},
publisher = {IEEE},
isbn = {978-1-4244-6033-5},
}