Influence of the clamping pressure on the electrical, thermal and mechanical behaviour of press-pack IGBTs

T. Poller, S. D'Arco, M. Hernes, A. Rygg Ardal, J. Lutz. Influence of the clamping pressure on the electrical, thermal and mechanical behaviour of press-pack IGBTs. Microelectronics Reliability, 53(9-11):1755-1759, 2013. [doi]

Abstract

Abstract is missing.