Robert Polster, Liang Yuan Dai, Oscar A. Jimenez, Qixiang Cheng, Michal Lipson, Keren Bergman. Wafer-scale High-Density Edge Coupling for High Throughput Testing of Silicon Photonics. In Optical Fiber Communications Conference and Exposition, OFC 2018, San Diego, CA, USA, March 11-15, 2018. pages 1-3, IEEE, 2018. [doi]
Abstract is missing.