Crack Catcher AI - Enabling Smart Fracture Mechanics Approach for Damage Control in Thin Silicon Wafers for 3D Semiconductor Integrated Devices/Packages

Gabriel Preston, Greer Gonzolez, Andrea S. Karnyoto, Fitya S. Mozar, Matthew M. Henry, Mahmud Isnan, Kuncahyo S. Nugroho, Henry Candra, Muhamad Doris, Dianing N. N. Putri, Tyas K. Sari, Bens Pardamean, Endang Djuana, Derrric Speaks, Arief S. Budiman. Crack Catcher AI - Enabling Smart Fracture Mechanics Approach for Damage Control in Thin Silicon Wafers for 3D Semiconductor Integrated Devices/Packages. In IEEE International Reliability Physics Symposium, IRPS 2025, Monterey, CA, USA, March 30 - April 3, 2025. pages 1-6, IEEE, 2025. [doi]