Shivam Priyadarshi, Niket K. Choudhary, Brandon H. Dwiel, Ankita Upreti, Eric Rotenberg, William Rhett Davis, Paul D. Franzon. 2 3D integration: A scheme for optimizing efficiency/cost of Chip Multiprocessors. In International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013. pages 1-7, IEEE, 2013. [doi]
@inproceedings{PriyadarshiCDURDF13,
title = {2 3D integration: A scheme for optimizing efficiency/cost of Chip Multiprocessors},
author = {Shivam Priyadarshi and Niket K. Choudhary and Brandon H. Dwiel and Ankita Upreti and Eric Rotenberg and William Rhett Davis and Paul D. Franzon},
year = {2013},
doi = {10.1109/ISQED.2013.6523582},
url = {http://dx.doi.org/10.1109/ISQED.2013.6523582},
researchr = {https://researchr.org/publication/PriyadarshiCDURDF13},
cites = {0},
citedby = {0},
pages = {1-7},
booktitle = {International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013},
publisher = {IEEE},
isbn = {978-1-4673-4951-2},
}