Laura Pruszko, Hongri Gu, Julien Bourgeois, Yann Laurillau, Céline Coutrix. Modular Tangible User Interfaces: Impact of Module Shape and Bonding Strength on Interaction. In Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2023, Warsaw, Poland, 26 February 2023- 1 March 2023. ACM, 2023. [doi]
@inproceedings{PruszkoGBLC23,
title = {Modular Tangible User Interfaces: Impact of Module Shape and Bonding Strength on Interaction},
author = {Laura Pruszko and Hongri Gu and Julien Bourgeois and Yann Laurillau and Céline Coutrix},
year = {2023},
doi = {10.1145/3569009.3572731},
url = {https://doi.org/10.1145/3569009.3572731},
researchr = {https://researchr.org/publication/PruszkoGBLC23},
cites = {0},
citedby = {0},
booktitle = {Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2023, Warsaw, Poland, 26 February 2023- 1 March 2023},
publisher = {ACM},
isbn = {978-1-4503-9977-7},
}