Laura Pruszko, Hongri Gu, Julien Bourgeois, Yann Laurillau, Céline Coutrix. Modular Tangible User Interfaces: Impact of Module Shape and Bonding Strength on Interaction. In Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction, TEI 2023, Warsaw, Poland, 26 February 2023- 1 March 2023. ACM, 2023. [doi]
Abstract is missing.