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Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests

Reinhard Pufall, Michael Goroll, J. Mahler, Werner Kanert, M. Bouazza, Olaf Wittler, Rainer Dudek. Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests. Microelectronics Reliability, 52(7):1266-1271, 2012. [doi]

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