Bo Qi, Wenxuan Chen, Zhenxiang Yi, Ming Qin, Qing-An Huang, Lili Gao. Package-Tolerant MEMS Thermal Wind Sensors Using SIG Technology. IEEE T. Instrumentation and Measurement, 74:1-9, 2025. [doi]
@article{QiCYQHG25,
title = {Package-Tolerant MEMS Thermal Wind Sensors Using SIG Technology},
author = {Bo Qi and Wenxuan Chen and Zhenxiang Yi and Ming Qin and Qing-An Huang and Lili Gao},
year = {2025},
doi = {10.1109/TIM.2025.3541663},
url = {https://doi.org/10.1109/TIM.2025.3541663},
researchr = {https://researchr.org/publication/QiCYQHG25},
cites = {0},
citedby = {0},
journal = {IEEE T. Instrumentation and Measurement},
volume = {74},
pages = {1-9},
}