Package-Tolerant MEMS Thermal Wind Sensors Using SIG Technology

Bo Qi, Wenxuan Chen, Zhenxiang Yi, Ming Qin, Qing-An Huang, Lili Gao. Package-Tolerant MEMS Thermal Wind Sensors Using SIG Technology. IEEE T. Instrumentation and Measurement, 74:1-9, 2025. [doi]

Abstract

Abstract is missing.