Modeling methodology: simulation based cause and effect analysis of cycle time and WIP in semiconductor wafer fabrication - researchr publication authors

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Chao Qi, Tuck Keat Tang, Appa Iyer Sivakumar. Modeling methodology: simulation based cause and effect analysis of cycle time and WIP in semiconductor wafer fabrication. In Jane L. Snowdon, John M. Charnes, editors, Proceedings of the 34th Winter Simulation Conference: Exploring New Frontiers, San Diego, California, USA, December 8-11, 2002. pages 1423-1430, ACM, 2002. [doi]

This author has not been identified. Look up 'Chao Qi' in GoogleThis author has not been identified. Look up 'Tuck Keat Tang' in GoogleThis author has not been identified. Look up 'Appa Iyer Sivakumar' in Google

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