Chao Qi, Tuck Keat Tang, Appa Iyer Sivakumar. Modeling methodology: simulation based cause and effect analysis of cycle time and WIP in semiconductor wafer fabrication. In Jane L. Snowdon, John M. Charnes, editors, Proceedings of the 34th Winter Simulation Conference: Exploring New Frontiers, San Diego, California, USA, December 8-11, 2002. pages 1423-1430, ACM, 2002. [doi]
Abstract is missing.