Libo Qian, Xitao He, Kefang Qian, Yinshui Xia. Study of silicon core coaxial through silicon via for three dimensional integration. In IEEE International Symposium on Circuits and Systems, ISCAS 2018, 27-30 May 2018, Florence, Italy. pages 1-4, IEEE, 2018. [doi]
Abstract is missing.