Comprehensive Wafer Level Package Die Processing Service quality control enhancement

John Qiao, Morn Jin, Wenwen He, Wei-Ting Kary Chien, Shirley Zhao. Comprehensive Wafer Level Package Die Processing Service quality control enhancement. In 2015 IEEE International Conference on Industrial Engineering and Engineering Management, IEEM 2015, Singapore, December 6-9, 2015. pages 1684-1688, IEEE, 2015. [doi]

Abstract

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