Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling

Delong Qiu, Liqiang Cao, Qidong Wang, Fengze Hou, XuGang Wang. Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling. Microelectronics Reliability, 74:34-43, 2017. [doi]

Abstract

Abstract is missing.