A O.96pJ/b 7 × 50Gb/s-per-Fiber WDM Receiver with Stacked 7nm CMOS and 45nm Silicon Photonic Dies

Mayank Raj, Chuan Xie, Ade Bekele, Adam Chou, Wenfeng Zhang, Ying Cao 0010, Jae Wook Kim, Nakul Narang, Hongyuan Zhao, Yipeng Wang 0003, Kee Hian Tan, Winson Lin, Jay Im, David Mahashin, Santiago Asuncion, Parag Upadhyaya, Yohan Frans. A O.96pJ/b 7 × 50Gb/s-per-Fiber WDM Receiver with Stacked 7nm CMOS and 45nm Silicon Photonic Dies. In IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023. pages 204-205, IEEE, 2023. [doi]

@inproceedings{RajXBCZCKNZWTLIMAUF23,
  title = {A O.96pJ/b 7 × 50Gb/s-per-Fiber WDM Receiver with Stacked 7nm CMOS and 45nm Silicon Photonic Dies},
  author = {Mayank Raj and Chuan Xie and Ade Bekele and Adam Chou and Wenfeng Zhang and Ying Cao 0010 and Jae Wook Kim and Nakul Narang and Hongyuan Zhao and Yipeng Wang 0003 and Kee Hian Tan and Winson Lin and Jay Im and David Mahashin and Santiago Asuncion and Parag Upadhyaya and Yohan Frans},
  year = {2023},
  doi = {10.1109/ISSCC42615.2023.10067617},
  url = {https://doi.org/10.1109/ISSCC42615.2023.10067617},
  researchr = {https://researchr.org/publication/RajXBCZCKNZWTLIMAUF23},
  cites = {0},
  citedby = {0},
  pages = {204-205},
  booktitle = {IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023},
  publisher = {IEEE},
  isbn = {978-1-6654-9016-0},
}