External Links

Cite Key

Statistics

  • References: 0
  • Cited by: 0
  • Reviews: 0
  • Bibliographies: 0

PDF

Researchr

Researchr is a web site for finding, collecting, sharing, and reviewing scientific publications, for researchers by researchers.

Sign up for an account to create a profile with publication list, tag and review your related work, and share bibliographies with your co-authors.

Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective

Pushparajah Rajaguru, Hua Lu 0003, Chris Bailey, Jose Angel Ortiz Gonzalez, Olayiwola Alatise. Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68:77-85, 2017. [doi]

Authors

Pushparajah Rajaguru

This author has not been identified. Look up 'Pushparajah Rajaguru' in Google

Hua Lu 0003

This author has not been identified. Look up 'Hua Lu 0003' in Google

Chris Bailey

This author has not been identified. Look up 'Chris Bailey' in Google

Jose Angel Ortiz Gonzalez

This author has not been identified. Look up 'Jose Angel Ortiz Gonzalez' in Google

Olayiwola Alatise

This author has not been identified. Look up 'Olayiwola Alatise' in Google
runs on