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Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective

Pushparajah Rajaguru, Hua Lu 0003, Chris Bailey, Jose Angel Ortiz Gonzalez, Olayiwola Alatise. Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectronics Reliability, 68:77-85, 2017. [doi]

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