Sreejith Kochupurackal Rajan, Ankit Kaul, Gary S. May, Muhannad S. Bakir. Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs. In IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021. pages 1-5, IEEE, 2021. [doi]
No references recorded for this publication.
No citations of this publication recorded.