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Liquid-Metal Vertical Interconnects for Flip Chip Assembly of GaAs C-Band Power Amplifiers Onto Micro-Rectangular Coaxial Transmission Lines

Parrish Ralston, Marcus Oliver, Krishna Vummidi, Sanjay Raman. Liquid-Metal Vertical Interconnects for Flip Chip Assembly of GaAs C-Band Power Amplifiers Onto Micro-Rectangular Coaxial Transmission Lines. J. Solid-State Circuits, 47(10):2327-2334, 2012. [doi]

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Parrish Ralston

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Marcus Oliver

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Krishna Vummidi

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Sanjay Raman

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