Thermal analysis and modeling of 3D integrated circuits for test scheduling - researchr publication authors

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Indira Rawat, M. K. Gupta, Virendra Singh. Thermal analysis and modeling of 3D integrated circuits for test scheduling. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-5, IEEE, 2013. [doi]

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