A holistic view of chip-level thermal architecture from heterogeneous stacked dice to system level in telecoms applications - researchr publication authors

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Gamal Refai-Ahmed, Ivor Barber, Anthony Torza, Brian Philofsky. A holistic view of chip-level thermal architecture from heterogeneous stacked dice to system level in telecoms applications. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]

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