Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization

Brice Rogié, Lorenzo Codecasa, Eric Monier-Vinard, Valentin Bissuel, Najib Laraqi, Olivier Daniel, Dario D'Amore, Alessandro Magnani, Vincenzo d'Alessandro, Niccolò Rinaldi. Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization. Microelectronics Reliability, 87:222-231, 2018. [doi]

@article{RogieCMBLDDMdR18,
  title = {Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization},
  author = {Brice Rogié and Lorenzo Codecasa and Eric Monier-Vinard and Valentin Bissuel and Najib Laraqi and Olivier Daniel and Dario D'Amore and Alessandro Magnani and Vincenzo d'Alessandro and Niccolò Rinaldi},
  year = {2018},
  doi = {10.1016/j.microrel.2018.06.009},
  url = {https://doi.org/10.1016/j.microrel.2018.06.009},
  researchr = {https://researchr.org/publication/RogieCMBLDDMdR18},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {87},
  pages = {222-231},
}