Brice Rogié, Lorenzo Codecasa, Eric Monier-Vinard, Valentin Bissuel, Najib Laraqi, Olivier Daniel, Dario D'Amore, Alessandro Magnani, Vincenzo d'Alessandro, Niccolò Rinaldi. Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization. Microelectronics Reliability, 87:222-231, 2018. [doi]
Abstract is missing.