Myong-Hoon Roh, Jae Pil Jung, Won Joong Kim. Microstructure, shear strength, and nanoindentation property of electroplated Sn-Bi micro-bumps. Microelectronics Reliability, 54(1):265-271, 2014. [doi]
@article{RohJK14,
title = {Microstructure, shear strength, and nanoindentation property of electroplated Sn-Bi micro-bumps},
author = {Myong-Hoon Roh and Jae Pil Jung and Won Joong Kim},
year = {2014},
doi = {10.1016/j.microrel.2013.09.016},
url = {http://dx.doi.org/10.1016/j.microrel.2013.09.016},
researchr = {https://researchr.org/publication/RohJK14},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {54},
number = {1},
pages = {265-271},
}