Microstructure, shear strength, and nanoindentation property of electroplated Sn-Bi micro-bumps

Myong-Hoon Roh, Jae Pil Jung, Won Joong Kim. Microstructure, shear strength, and nanoindentation property of electroplated Sn-Bi micro-bumps. Microelectronics Reliability, 54(1):265-271, 2014. [doi]

Abstract

Abstract is missing.