Moisture absorption and desorption in wafer level chip scale packages

Kirsten Rongen, A. Mavinkurve, M. Chen, P. J. van der Wel, F. Swartjes, R. T. H. Rongen. Moisture absorption and desorption in wafer level chip scale packages. Microelectronics Reliability, 55(9-10):1872-1876, 2015. [doi]

Abstract

Abstract is missing.