R. T. H. Rongen, R. Roucou, P. J. vd Wel, F. C. Voogt, F. Swartjes, Kirsten Weide-Zaage. Reliability of Wafer Level Chip Scale Packages. Microelectronics Reliability, 54(9-10):1988-1994, 2014. [doi]
@article{RongenRWVSW14,
title = {Reliability of Wafer Level Chip Scale Packages},
author = {R. T. H. Rongen and R. Roucou and P. J. vd Wel and F. C. Voogt and F. Swartjes and Kirsten Weide-Zaage},
year = {2014},
doi = {10.1016/j.microrel.2014.07.012},
url = {http://dx.doi.org/10.1016/j.microrel.2014.07.012},
researchr = {https://researchr.org/publication/RongenRWVSW14},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {54},
number = {9-10},
pages = {1988-1994},
}