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R. T. H. Rongen, R. Roucou, P. J. vd Wel, F. C. Voogt, F. Swartjes, Kirsten Weide-Zaage. Reliability of Wafer Level Chip Scale Packages. Microelectronics Reliability, 54(9-10):1988-1994, 2014. [doi]
Abstract is missing.