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XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects

G. Ross, V. Vuorinen, M. Krause, S. Reissaus, M. Petzold, Mervi Paulasto-Kröckel. XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects. Microelectronics Reliability, 76:390-394, 2017. [doi]

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G. Ross

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V. Vuorinen

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M. Krause

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S. Reissaus

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M. Petzold

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Mervi Paulasto-Kröckel

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