G. Ross, V. Vuorinen, M. Krause, S. Reissaus, M. Petzold, Mervi Paulasto-Kröckel. XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects. Microelectronics Reliability, 76:390-394, 2017. [doi]
@article{RossVKRPP17,
title = {XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects},
author = {G. Ross and V. Vuorinen and M. Krause and S. Reissaus and M. Petzold and Mervi Paulasto-Kröckel},
year = {2017},
doi = {10.1016/j.microrel.2017.07.044},
url = {https://doi.org/10.1016/j.microrel.2017.07.044},
researchr = {https://researchr.org/publication/RossVKRPP17},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {76},
pages = {390-394},
}